MICRON

Box Weight Brutto (kg): 0.02 kg , CAS Latency: CL22 , Compliant Devices: Server , Height (mm): 31.25 mm , Kapacitet: 8 GB , Maximum Non-Operating Ambient Temperature: 100 °C , Maximum Non-Operating Humidity: 95 % , Maximum Operating Ambient Tempera

Box Weight Brutto (kg): 0.02 kg , CAS Latency: CL22 , Compliant Devices: Server , Kapacitet: 16 GB , Maximum Operating Ambient Temperature: 95 °C , Memory Features: Registered Single Rank Low Power ODT SPD EEPROM , Memory Form Factor: DIMM 288-pin

Box Weight Brutto (kg): 0.05 kg , CAS Latency: CL22 , Compliant Devices: Server , Kapacitet: 32 GB , Memory Features: Registered Single Rank , Memory Form Factor: DIMM 288-pin , Memory Modules Quantity: 1 , Memory Speed: 3200MHz(PC4-25600) , Memory

Box Weight Brutto (kg): 0.05 kg , CAS Latency: CL22 , Compliant Devices: Server , Kapacitet: 32 GB , Maximum Operating Ambient Temperature: 85 °C , Maximum Operating Humidity: 95 % , Memory Features: Registered Dual Rank , Memory Form Factor: DIMM

Box Weight Brutto (kg): 0.01 kg , CAS Latency: CL22 , Compliant Devices: Server , Kapacitet: 64 GB , Memory Features: Registered Single Rank , Memory Form Factor: DIMM 288-pin , Memory Modules Quantity: 1 , Memory Speed: 3200MHz(PC4-25600) , Memory

Box Weight Brutto (kg): 0.07 kg , Depth (mm): 100.45 mm , Device Location: Internal , Drive Writes Per Day (DWPD): 1.5 , External Data Bit Rate: 6 Gbps , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: 2.5" , Height (mm): 7 mm , Kapa

Box Weight Brutto (kg): 0.07 kg , Depth (mm): 100.45 mm , Device Location: Internal , Drive Writes Per Day (DWPD): 1.5 , External Data Bit Rate: 6 Gbps , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: 2.5" , Height (mm): 7 mm , Kapa

Box Weight Brutto (kg): 0.09 kg , Device Location: Plug-in Module , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: M.2 (22110) , Kapacitet: 1.92 TB , Maximum Operating Ambient Temperature: 70 °C , Maximum Power Consumption: 8 W , Ma

Box Weight Brutto (kg): 0.09 kg , Device Location: Plug-in Module , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: U3 , Kapacitet: 1.92 TB , Maximum Operating Ambient Temperature: 70 °C , Maximum Power Consumption: 16.6 W , Maximum

Box Weight Brutto (kg): 0.09 kg , Device Location: Plug-in Module , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: M.2 (22110) , Kapacitet: 3840 TB , Maximum Operating Ambient Temperature: 70 °C , Maximum Power Consumption: 8 W , Ma

Box Weight Brutto (kg): 0.07 kg , Depth (mm): 100.45 mm , Device Location: Internal , Drive Writes Per Day (DWPD): 1.5 , External Data Bit Rate: 6 Gbps , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: 2.5" , Height (mm): 7 mm , Kapa

Box Weight Brutto (kg): 0.07 kg , Depth (mm): 100.45 mm , Device Location: Internal , Drive Writes Per Day (DWPD): 0.6 , External Data Bit Rate: 6 Gbps , Flash Memory Cell Technology: Triple-Level Cell , Form Factor: 2.5" , Height (mm): 7 mm , Kapa